Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, has demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on Taiwan Semiconductor Manufacturing Company’s (TSMC) 3-nanometer (3nm) process. Marvell’s industry-first silicon building blocks in this node include 112G XSR SerDes (serializer/de-serializer), Long Reach SerDes, PCIe Gen 6 / CXL 3.0 SerDes, and a 240 Tbps parallel die-to-die interconnect.
The post Marvell Demonstrates Industry’s First 3nm Data Infrastructure Silicon appeared first on HPCwire.
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